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ITC2014 - Direct Probing Micro Bumps

Experiments show the technical feasibility of the direct probing approach, with probe tips making proper electrical contact to the micro-bumps, causing only limited probe marks and no measureable impact on stack interconnect yield. Cost modeling indicates economic feasibility for single-site testing, with the next step to prepare the technology for volume production.

ITC2014 - Direct Probing Micro Bumps

Created: August 23, 2017 | Updated: August 23, 2017 | Type: pdf | Size: 1.89 MB

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